Bergquist Company TGP 2202SF Silicone-Free GAP PAD®

Bergquist TGP 2202SF Silicone-Free GAP PAD® are high-performance, 2.0W/m-K, thermally conductive gap filling material that is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. The gap pads are specifically designed for silicone-sensitive applications. The material’s construction features a 0.5mil PET film on one side and a natural tack on the other. The natural tack eliminates the need for an additional adhesive layer. The Bergquist TGP 2202SF Silicone-Free GAP PAD® are available in sheet form and are gray in appearance. Typical thermal management applications include hard drives, set-top boxes, and optical applications.