Bergquist Company Liqui-Form TLF 3800LVO Liquid Formable Gel
Bergquist Company Liqui-Form TLF 3800LVO Liquid Formable Gel provides low volatility, low assembly stress, and high thermal conductivity for high reliability. The 3800LVO is a one-part, pre-cured, liquid thermal interface material (TIM) that is designed for demanding applications. This gel-based medium has a consistent and stable viscosity, allowing for high shot-to-shot consistency for volume manufacturing. Bergquist Liqui-Form TLF 3800LVO Liquid Formable Gel features a high thermal conductivity of 3.8W/m-K, excellent thermal cycling reliability, reworkability, and low siloxane volatility for silicone-sensitive applications.
Features
- Dispensable pre-cured gel
- Minimized outgassing with low siloxane less than 100ppm
- Elimination of stress-related component failures
- Device/thermal cycling reliability
- Ultra-conforming with excellent wet-out in application
- Stable viscosity in storage and in the application
- Thorough gap filling for small, complex, intricate, and delicate architectures
- Low volatility for silicone-sensitive applications
- High vibration resistance
- 3.8 W/m-K thermal conductivity
- Excellent chemical stability and mechanical stability
- Ease of rework capability protects assembly value
- Room-temperature storage
- Available with and without glass beads in different cartridges and pail sizes
Applications
- Handheld devices
- Bare die to heat spreader lid
- Filling various gaps between heat-generating devices to heat sink and housing
- Devices requiring low assembly pressure
- High-value assemblies with rework
- BGA, PGA, PPGA
Additional Resources
Publicado: 2020-04-17
| Actualizado: 2022-03-11